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VIETNAM ZIITEK TECHNOLOGY CO.,LTD Vietnam Ziitek Technology Company Limited
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TIF035-05 Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat

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TIF035-05 Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat

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Brand Name : Ziitek

Model Number : TIF035-05

Certification : RoHS

Place of Origin : Vietnam

MOQ : 1000tube

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 tube/month

Delivery Time : 3-5 work days

Packaging Details : 300cc/tube

Products name : Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat

Materail : Ceramic Filled Silicon Material

Keywords : Thermal conductive gel

Color : Blue

Specific Gravity : 3.2g/cm³

Thermal conductivity : 3.5W/mK

Continuous Use Temperature : -45~200℃

Application : Heat Sink Dissipate Heat

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Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat

TIF035-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF035-05 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.


TIF035-05 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF035-05 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component.

Feature
> Thermal conductivity: 3.5W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly

Application
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)

TIFTM035-05 Typical Properties
Property Value Test method
Color blue Visual
Construction & Composition Ceramic filled silicon material *****
Viscosity 2000K mPa.s GB/T 10247
Density 3.2g/cm³ ASTM D297
Thermal conductivity 3.5W/mK ASTM D5470
Thermal diffusivity 1.1073 mm²/s ISO 22007-2
Specific heat capacity 3.3 MJ/m3K ISO 22007-2
Continuous Use Temperature -45 ~200°C Ziitek Test Method
Dielectric breakdown strength 200 V/mil ASTM D149
Outgassing(TML) 0.80% ASTM E595
Flame Rating 94V0 UL E331100

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

TIF035-05 Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Q&A

Q: Are you trading company or manufacturer ?

A: We are manufacturer in Vietnam.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.


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TIF035-05 Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat Images

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